Fan out wafer level packaging heater
On the FO-WLP line, the bake step is where yield quietly slips away. A soft bake that drifts by 2°C throws off the photoresist profile. Run the hard...
Wafer level CSP (Chip Scale Package) heater
Out on the packaging floor, a CSP heater going down stops the whole line. Every minute of unplanned downtime means scrapped wafers and margin going...